Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users (Marco Chiappetta/Forbes)
Cadence launched an AI agent platform for PCB and advanced packaging workflows, with major semiconductor and industrial customers already using it.
Excerpt
<a href="https://www.forbes.com/sites/marcochiappetta/2026/07/15/cadence-expands-ai-agents-with-aurastack-for-pcb-and-advanced-chip-packaging/"><img align="RIGHT" border="0" hspace="4" src="http://www.techmeme.com/260715/i51.jpg" vspace="4" /></a>
<p><a href="https://www.techmeme.com/260715/p51#a260715p51" title="Techmeme permalink"><img height="12" src="http://www.techmeme.com/img/pml.png" style="border: none; padding: 0; margin: 0;" width="11" /></a> Marco Chiappetta / <a href="http://www.forbes.com/">Forbes</a>:<br />
<span style="font-size: 1.3em;"><b><a href="https://www.forbes.com/sites/marcochiappetta/2026/07/15/cadence-expands-ai-agents-with-aurastack-for-pcb-and-advanced-chip-packaging/">Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users</a></b></span> — As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.</p>
Read at source: https://www.techmeme.com/260715/p51#a260715p51