Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)
ASML has secured the industry roadmap for its most advanced lithography gear.
Samsung plans to use High NA EUV for high-volume manufacturing by 2028, while TSMC is slated to begin from 2030. Intel is already on the path, and the companies are also backing a move to larger 12-inch photomasks to improve productivity. The commitments strengthen ASML’s position at the center of next-generation chipmaking as AI demand pushes foundries toward denser, more complex chips. Techmeme's note
Samsung plans to use High NA EUV for high-volume manufacturing by 2028, while TSMC is slated to begin from 2030. Intel is already on the path, and the companies are also backing a move to larger 12-inch photomasks to improve productivity. The commitments strengthen ASML’s position at the center of next-generation chipmaking as AI demand pushes foundries toward denser, more complex chips. Techmeme's note
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