Sources: TSMC is developing advanced AI chip packaging tech, internally called "EMIB-like", similar to Intel's Embedded Multi-die Interconnect Bridge technique (Qianer Liu/The Information)
TSMC is developing advanced AI chip packaging technology to improve multi-die integration and compete with Intel’s EMIB approach.
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<a href="https://www.theinformation.com/articles/tsmc-develops-ai-chip-packaging-tech-counter-intel"><img align="RIGHT" border="0" hspace="4" src="http://www.techmeme.com/260730/i24.jpg" vspace="4" /></a>
<p><a href="https://www.techmeme.com/260730/p24#a260730p24" title="Techmeme permalink"><img height="12" src="http://www.techmeme.com/img/pml.png" style="border: none; padding: 0; margin: 0;" width="11" /></a> Qianer Liu / <a href="https://www.theinformation.com/">The Information</a>:<br />
<span style="font-size: 1.3em;"><b><a href="https://www.theinformation.com/articles/tsmc-develops-ai-chip-packaging-tech-counter-intel">Sources: TSMC is developing advanced AI chip packaging tech, internally called “EMIB-like”, similar to Intel's Embedded Multi-die Interconnect Bridge technique</a></b></span> — Taiwan Semiconductor Manufacturing Co. is developing an advanced chip-packaging technology similar to what Intel already offers … </p>
Read at source: https://www.techmeme.com/260730/p24#a260730p24