SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 (Bloomberg)
The Indiana site is SK Hynix’s first U.S. base for packaging high-bandwidth memory used in AI chips.
The company held a groundbreaking ceremony for the $4 billion facility near Purdue University. Mass production of next-generation HBM is scheduled for the second half of 2029. The linked coverage notes the plant will package, rather than fabricate, the memory chips. Techmeme's note
The company held a groundbreaking ceremony for the $4 billion facility near Purdue University. Mass production of next-generation HBM is scheduled for the second half of 2029. The linked coverage notes the plant will package, rather than fabricate, the memory chips. Techmeme's note
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