Samsung previews zHBM, which vertically stacks HBM atop AI accelerators, and zNAND-O, built on V-NAND, and unveils the industry's first V10 BV-NAND architecture (Yoolim Lee/Bloomberg)
Samsung is pitching 3D memory as a way to move data faster and use less power in AI systems.
The preview includes zHBM, which stacks high-bandwidth memory directly on top of AI accelerators. Samsung also showed zNAND-O, based on its V-NAND technology, and said it has built the industry’s first V10 BV-NAND architecture. The company framed the hardware as part of its next-generation memory push for AI infrastructure. Techmeme's note
The preview includes zHBM, which stacks high-bandwidth memory directly on top of AI accelerators. Samsung also showed zNAND-O, based on its V-NAND technology, and said it has built the industry’s first V10 BV-NAND architecture. The company framed the hardware as part of its next-generation memory push for AI infrastructure. Techmeme's note
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